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EP2S60F672I5

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Спецификация Часто задаваемые вопросы
  • Mounting Type:Surface Mount
  • Package / Case:672-BGA
  • Surface Mount:YES
  • Supplier Device Package:672-FBGA (27x27)
  • Number of Terminals:672
  • Number of I/Os:492
  • Package:Tray
  • Mfr:Intel
  • Product Status:Obsolete
  • Package Description:BGA, BGA672,26X26,40
  • Package Style:GRID ARRAY
  • Moisture Sensitivity Levels:3
  • Package Body Material:PLASTIC
  • Package Equivalence Code:BGA672,26X26,40
  • Reflow Temperature-Max (s):30
  • Rohs Code:No
  • Manufacturer Part Number:EP2S60F672I5
  • Package Code:BGA
  • Package Shape:SQUARE
  • Manufacturer:Intel Corporation
  • Part Life Cycle Code:Not Recommended
  • Ihs Manufacturer:INTEL CORP
  • Risk Rank:5.62
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Series:Stratix® II
  • JESD-609 Code:e0
  • ECCN Code:3A001.A.7.A
  • Terminal Finish:TIN LEAD
  • HTS Code:8542.39.00.01
  • Subcategory:Field Programmable Gate Arrays
  • Technology:CMOS
  • Voltage - Supply:1.15V ~ 1.25V
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):220
  • Terminal Pitch:1 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:S-PBGA-B672
  • Number of Outputs:484
  • Qualification Status:Not Qualified
  • Power Supplies:1.2,1.5/3.3,3.3 V
  • Number of Inputs:492
  • Programmable Logic Type:FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells:60440
  • Number of LABs/CLBs:3022
  • Number of Logic Cells:60440

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