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HY27UF082G2B-TPCB

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:48
  • Package Description:TSSOP, TSSOP48,.8,20
  • Package Style:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
  • Moisture Sensitivity Levels:3
  • Number of Words Code:256000000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:TSSOP48,.8,20
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Access Time-Max:20 ns
  • Operating Temperature-Max:70 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:HY27UF082G2B-TPCB
  • Number of Words:268435456 words
  • Package Code:TSSOP
  • Package Shape:RECTANGULAR
  • Manufacturer:SK Hynix Inc
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:SK HYNIX INC
  • Risk Rank:8.55
  • JESD-609 Code:e6
  • Pbfree Code:Yes
  • Type:NAND TYPE
  • Terminal Finish:Tin/Bismuth (Sn/Bi)
  • Subcategory:Flash Memories
  • Technology:CMOS
  • Terminal Position:DUAL
  • Terminal Form:GULL WING
  • Peak Reflow Temperature (Cel):260
  • Terminal Pitch:0.5 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PDSO-G48
  • Qualification Status:Not Qualified
  • Power Supplies:3/3.3 V
  • Temperature Grade:COMMERCIAL
  • Supply Current-Max:0.03 mA
  • Organization:256MX8
  • Memory Width:8
  • Standby Current-Max:0.00005 A
  • Memory Density:2147483648 bit
  • Parallel/Serial:PARALLEL
  • Memory IC Type:FLASH
  • Data Polling:NO
  • Toggle Bit:NO
  • Command User Interface:YES
  • Number of Sectors/Size:2K
  • Sector Size:128K
  • Page Size:2K words
  • Ready/Busy:YES

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