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MT29F1G08ABBHC-ET:B

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:63
  • Package Description:FBGA, BGA63,10X12,32
  • Package Style:GRID ARRAY, FINE PITCH
  • Moisture Sensitivity Levels:1
  • Number of Words Code:128000000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA63,10X12,32
  • Operating Temperature-Min:-40 °C
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Access Time-Max:30 ns
  • Operating Temperature-Max:85 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:MT29F1G08ABBHC-ET:B
  • Number of Words:134217728 words
  • Supply Voltage-Nom (Vsup):1.8 V
  • Package Code:FBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:Micron Technology Inc
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:MICRON TECHNOLOGY INC
  • Risk Rank:8.53
  • JESD-609 Code:e3
  • Pbfree Code:Yes
  • Type:SLC NAND TYPE
  • Terminal Finish:Matte Tin (Sn)
  • Subcategory:Flash Memories
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):225
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PBGA-B63
  • Qualification Status:Not Qualified
  • Power Supplies:1.8 V
  • Temperature Grade:INDUSTRIAL
  • Interface:Parallel
  • Supply Current-Max:0.02 mA
  • Access Time:30
  • Organization:128MX8
  • Memory Width:8
  • Standby Current-Max:0.00005 A
  • Memory Density:1
  • Parallel/Serial:PARALLEL
  • Memory IC Type:FLASH
  • Data Polling:NO
  • Toggle Bit:NO
  • Command User Interface:YES
  • Number of Sectors/Size:1K
  • Sector Size:128K
  • Page Size:2K words
  • Ready/Busy:YES

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