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N25Q256A13E1240F

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:24
  • Package Description:TBGA, BGA24,5X5,40
  • Package Style:GRID ARRAY, THIN PROFILE
  • Number of Words Code:256000000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA24,5X5,40
  • Operating Temperature-Min:-40 °C
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Operating Temperature-Max:85 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:N25Q256A13E1240F
  • Clock Frequency-Max (fCLK):108 MHz
  • Number of Words:268435456 words
  • Supply Voltage-Nom (Vsup):3 V
  • Package Code:TBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:Micron Technology Inc
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:MICRON TECHNOLOGY INC
  • Risk Rank:5.74
  • JESD-609 Code:e1
  • Pbfree Code:Yes
  • Type:NOR TYPE
  • Terminal Finish:Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Number of Functions:1
  • Terminal Pitch:1 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PBGA-B24
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):3.6 V
  • Temperature Grade:INDUSTRIAL
  • Supply Voltage-Min (Vsup):2.7 V
  • Operating Mode:SYNCHRONOUS
  • Supply Current-Max:0.02 mA
  • Organization:256MX1
  • Seated Height-Max:1.2 mm
  • Memory Width:1
  • Standby Current-Max:0.00025 A
  • Memory Density:268435456 bit
  • Parallel/Serial:SERIAL
  • Memory IC Type:FLASH
  • Programming Voltage:3 V
  • Serial Bus Type:SPI
  • Data Retention Time-Min:20
  • Write Protection:HARDWARE/SOFTWARE
  • Width:6 mm
  • Length:8 mm

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