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H55S5122DFR-60M

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:90
  • Package Description:FBGA, BGA90,9X15,32
  • Package Style:GRID ARRAY, FINE PITCH
  • Number of Words Code:16000000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA90,9X15,32
  • Operating Temperature-Min:-30 °C
  • Access Time-Max:5.4 ns
  • Operating Temperature-Max:85 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:H55S5122DFR-60M
  • Clock Frequency-Max (fCLK):166 MHz
  • Number of Words:16777216 words
  • Supply Voltage-Nom (Vsup):1.8 V
  • Package Code:FBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:SK Hynix Inc
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:SK HYNIX INC
  • Risk Rank:5.81
  • JESD-609 Code:e1
  • Terminal Finish:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Subcategory:DRAMs
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PBGA-B90
  • Qualification Status:Not Qualified
  • Power Supplies:1.8 V
  • Temperature Grade:OTHER
  • Supply Current-Max:0.1 mA
  • Organization:16MX32
  • Output Characteristics:3-STATE
  • Memory Width:32
  • Standby Current-Max:0.0003 A
  • Memory Density:536870912 bit
  • I/O Type:COMMON
  • Memory IC Type:SYNCHRONOUS DRAM
  • Refresh Cycles:8192
  • Sequential Burst Length:1,2,4,8,FP
  • Interleaved Burst Length:1,2,4,8

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