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K7Q163652A-FC16
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Спецификация Часто задаваемые вопросы
- Surface Mount:YES
- Number of Terminals:165
- Package Description:LBGA, BGA165,11X15,40
- Package Style:GRID ARRAY, LOW PROFILE
- Number of Words Code:512000
- Package Body Material:PLASTIC/EPOXY
- Package Equivalence Code:BGA165,11X15,40
- Reflow Temperature-Max (s):30
- Access Time-Max:2.5 ns
- Operating Temperature-Max:70 °C
- Rohs Code:No
- Manufacturer Part Number:K7Q163652A-FC16
- Clock Frequency-Max (fCLK):166.66 MHz
- Number of Words:524288 words
- Supply Voltage-Nom (Vsup):2.5 V
- Package Code:LBGA
- Package Shape:RECTANGULAR
- Manufacturer:Samsung Semiconductor
- Part Life Cycle Code:Obsolete
- Ihs Manufacturer:SAMSUNG SEMICONDUCTOR INC
- Risk Rank:5.88
- Part Package Code:BGA
- JESD-609 Code:e0
- ECCN Code:3A991.B.2.A
- Terminal Finish:Tin/Lead (Sn/Pb)
- Additional Feature:PIPELINED ARCHITECTURE
- HTS Code:8542.32.00.41
- Subcategory:SRAMs
- Technology:CMOS
- Terminal Position:BOTTOM
- Terminal Form:BALL
- Peak Reflow Temperature (Cel):240
- Number of Functions:1
- Terminal Pitch:1 mm
- Reach Compliance Code:compliant
- Pin Count:165
- JESD-30 Code:R-PBGA-B165
- Qualification Status:Not Qualified
- Supply Voltage-Max (Vsup):2.6 V
- Power Supplies:1.5/1.8,2.5 V
- Temperature Grade:COMMERCIAL
- Supply Voltage-Min (Vsup):2.4 V
- Operating Mode:SYNCHRONOUS
- Supply Current-Max:0.59 mA
- Organization:512KX36
- Output Characteristics:3-STATE
- Seated Height-Max:1.4 mm
- Memory Width:36
- Standby Current-Max:0.22 A
- Memory Density:18874368 bit
- Parallel/Serial:PARALLEL
- I/O Type:SEPARATE
- Memory IC Type:QDR SRAM
- Standby Voltage-Min:2.4 V
- Width:13 mm
- Length:15 mm
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