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Lagernummer 0

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:165
  • Package Description:LBGA, BGA165,11X15,40
  • Package Style:GRID ARRAY, LOW PROFILE
  • Number of Words Code:512000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA165,11X15,40
  • Reflow Temperature-Max (s):30
  • Access Time-Max:2.5 ns
  • Operating Temperature-Max:70 °C
  • Rohs Code:No
  • Manufacturer Part Number:K7Q163652A-FC16
  • Clock Frequency-Max (fCLK):166.66 MHz
  • Number of Words:524288 words
  • Supply Voltage-Nom (Vsup):2.5 V
  • Package Code:LBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:Samsung Semiconductor
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:SAMSUNG SEMICONDUCTOR INC
  • Risk Rank:5.88
  • Part Package Code:BGA
  • JESD-609 Code:e0
  • ECCN Code:3A991.B.2.A
  • Terminal Finish:Tin/Lead (Sn/Pb)
  • Additional Feature:PIPELINED ARCHITECTURE
  • HTS Code:8542.32.00.41
  • Subcategory:SRAMs
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):240
  • Number of Functions:1
  • Terminal Pitch:1 mm
  • Reach Compliance Code:compliant
  • Pin Count:165
  • JESD-30 Code:R-PBGA-B165
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):2.6 V
  • Power Supplies:1.5/1.8,2.5 V
  • Temperature Grade:COMMERCIAL
  • Supply Voltage-Min (Vsup):2.4 V
  • Operating Mode:SYNCHRONOUS
  • Supply Current-Max:0.59 mA
  • Organization:512KX36
  • Output Characteristics:3-STATE
  • Seated Height-Max:1.4 mm
  • Memory Width:36
  • Standby Current-Max:0.22 A
  • Memory Density:18874368 bit
  • Parallel/Serial:PARALLEL
  • I/O Type:SEPARATE
  • Memory IC Type:QDR SRAM
  • Standby Voltage-Min:2.4 V
  • Width:13 mm
  • Length:15 mm

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