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GS840H36AGB-166I

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Zwischensummenbetrag $0.00000

Спецификация Часто задаваемые вопросы
  • Factory Lead Time:8 Weeks
  • Surface Mount:YES
  • Number of Terminals:119
  • Package Description:BGA,
  • Package Style:GRID ARRAY
  • Moisture Sensitivity Levels:3
  • Number of Words Code:128000
  • Package Body Material:PLASTIC/EPOXY
  • Operating Temperature-Min:-40 °C
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Access Time-Max:8.5 ns
  • Operating Temperature-Max:85 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:GS840H36AGB-166I
  • Number of Words:131072 words
  • Supply Voltage-Nom (Vsup):3.3 V
  • Package Code:BGA
  • Package Shape:RECTANGULAR
  • Manufacturer:GSI Technology
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:GSI TECHNOLOGY
  • Risk Rank:5.28
  • Part Package Code:BGA
  • JESD-609 Code:e1
  • Pbfree Code:Yes
  • ECCN Code:3A991.B.2.B
  • Terminal Finish:TIN SILVER COPPER
  • Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
  • HTS Code:8542.32.00.41
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):260
  • Number of Functions:1
  • Terminal Pitch:1.27 mm
  • Reach Compliance Code:compliant
  • Pin Count:119
  • JESD-30 Code:R-PBGA-B119
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):3.6 V
  • Temperature Grade:INDUSTRIAL
  • Supply Voltage-Min (Vsup):3 V
  • Operating Mode:SYNCHRONOUS
  • Organization:128KX36
  • Seated Height-Max:2.19 mm
  • Memory Width:36
  • Memory Density:4.5
  • Parallel/Serial:PARALLEL
  • Memory IC Type:CACHE SRAM
  • Width:14 mm
  • Length:22 mm

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