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GS8662Q36E-250

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Zwischensummenbetrag $0.00000

Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:165
  • Package Description:15 X 17 MM, 1 MM PITCH, FPBGA-165
  • Package Style:GRID ARRAY, LOW PROFILE
  • Moisture Sensitivity Levels:3
  • Number of Words Code:2000000
  • Package Body Material:PLASTIC/EPOXY
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Access Time-Max:0.45 ns
  • Operating Temperature-Max:70 °C
  • Rohs Code:No
  • Manufacturer Part Number:GS8662Q36E-250
  • Number of Words:2097152 words
  • Supply Voltage-Nom (Vsup):1.8 V
  • Package Code:LBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:GSI Technology
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:GSI TECHNOLOGY
  • Risk Rank:5.71
  • Part Package Code:BGA
  • Pbfree Code:No
  • ECCN Code:3A991.B.2.B
  • Additional Feature:PIPELINED ARCHITECTURE
  • HTS Code:8542.32.00.41
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Number of Functions:1
  • Terminal Pitch:1 mm
  • Reach Compliance Code:compliant
  • Pin Count:165
  • JESD-30 Code:R-PBGA-B165
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):1.9 V
  • Temperature Grade:COMMERCIAL
  • Supply Voltage-Min (Vsup):1.7 V
  • Operating Mode:SYNCHRONOUS
  • Organization:2MX36
  • Seated Height-Max:1.5 mm
  • Memory Width:36
  • Memory Density:75497472 bit
  • Parallel/Serial:PARALLEL
  • Memory IC Type:STANDARD SRAM
  • Width:15 mm
  • Length:17 mm

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