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93LC66B-I/PG

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Спецификация Часто задаваемые вопросы
  • Surface Mount:NO
  • Number of Terminals:8
  • Package Description:DIP, DIP8,.3
  • Package Style:IN-LINE
  • Number of Words Code:256
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:DIP8,.3
  • Operating Temperature-Min:-40 °C
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Operating Temperature-Max:85 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:93LC66B-I/PG
  • Clock Frequency-Max (fCLK):1 MHz
  • Number of Words:256 words
  • Supply Voltage-Nom (Vsup):2.5 V
  • Package Code:DIP
  • Package Shape:RECTANGULAR
  • Manufacturer:Microchip Technology Inc
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:MICROCHIP TECHNOLOGY INC
  • Risk Rank:5.13
  • Part Package Code:DIP
  • JESD-609 Code:e3
  • Pbfree Code:Yes
  • ECCN Code:EAR99
  • Terminal Finish:Matte Tin (Sn)
  • HTS Code:8542.32.00.51
  • Subcategory:EEPROMs
  • Technology:CMOS
  • Terminal Position:DUAL
  • Terminal Form:THROUGH-HOLE
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Number of Functions:1
  • Terminal Pitch:2.54 mm
  • Reach Compliance Code:compliant
  • Pin Count:8
  • JESD-30 Code:R-PDIP-T8
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):5.5 V
  • Power Supplies:3/5 V
  • Temperature Grade:INDUSTRIAL
  • Supply Voltage-Min (Vsup):1.8 V
  • Operating Mode:SYNCHRONOUS
  • Supply Current-Max:0.002 mA
  • Organization:256X16
  • Seated Height-Max:5.33 mm
  • Memory Width:16
  • Standby Current-Max:0.000001 A
  • Memory Density:4096 bit
  • Parallel/Serial:SERIAL
  • Memory IC Type:EEPROM
  • Serial Bus Type:MICROWIRE
  • Endurance:1000000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC):6 ms
  • Data Retention Time-Min:200
  • Write Protection:SOFTWARE
  • Width:7.62 mm
  • Length:9.27 mm

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