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GS81313HT18GK-675
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GSI Technology
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Память
- BGA-260
- SRAM
Date Sheet
Lagernummer 2272
Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Package / Case：BGA-260
- Surface Mount：YES
- Number of Terminals：260
- RoHS：Details
- Maximum Clock Frequency：675 MHz
- Interface Type：Parallel
- Minimum Operating Temperature：0 C
- Maximum Operating Temperature：+ 70 C
- Mounting Styles：SMD/SMT
- Moisture Sensitive：Yes
- Factory Pack QuantityFactory Pack Quantity：10
- Tradename：SigmaDDR-IIIe
- Package Description：HBGA, BGA260,13X20,40
- Package Style：GRID ARRAY, HEAT SINK/SLUG
- Number of Words Code：8000000
- Package Body Material：PLASTIC/EPOXY
- Package Equivalence Code：BGA260,13X20,40
- Operating Temperature-Max：85 °C
- Rohs Code：Yes
- Manufacturer Part Number：GS81313HT18GK-675
- Clock Frequency-Max (fCLK)：675 MHz
- Number of Words：8388608 words
- Supply Voltage-Nom (Vsup)：1.25 V
- Package Code：HBGA
- Package Shape：RECTANGULAR
- Part Life Cycle Code：Active
- Ihs Manufacturer：GSI TECHNOLOGY
- Risk Rank：5.74
- Packaging：Tray
- Series：GS81313HT18GK
- ECCN Code：3A991.B.2.B
- Type：Synchronous
- Technology：CMOS
- Terminal Position：BOTTOM
- Terminal Form：BALL
- Number of Functions：1
- Terminal Pitch：1 mm
- Reach Compliance Code：compliant
- JESD-30 Code：R-PBGA-B260
- Qualification Status：Not Qualified
- Supply Voltage-Max (Vsup)：1.35 V
- Power Supplies：1.25 V
- Temperature Grade：OTHER
- Supply Voltage-Min (Vsup)：1.2 V
- Operating Mode：SYNCHRONOUS
- Organization：8MX18
- Output Characteristics：3-STATE
- Seated Height-Max：2.3 mm
- Memory Width：18
- Memory Density：150994944 bit
- Parallel/Serial：PARALLEL
- I/O Type：COMMON
- Memory IC Type：DDR SRAM
- Standby Voltage-Min：1.2 V
- Width：14 mm
- Length：22 mm
Со склада 2272
Итого $0.00000
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