W29N02GVBIAF TR

Name: Winbond Electronics Corporation W29N02GVBIAF TR
Brand: Winbond Electronics Corporation
Rating: 4.6 (18 reviews)

Lagernummer 21

Zwischensummenbetrag $0.00000

Спецификация Часто задаваемые вопросы

EU RoHS：Compliant
ECCN (US)：3A991.b.1.a
HTS：8542.32.00.71
Automotive：No
PPAP：No
Cell Type：SLC NAND
Chip Density (bit)：2G
Address Bus Width (bit)：28
Number of Bits/Word (bit)：8
Number of Words：256M
Programmability：Yes
Timing Type：Asynchronous
Max. Access Time (ns)：25
Maximum Erase Time (S)：0.01/Block
Maximum Programming Time (ms)：0.7
Interface Type：Parallel
Minimum Operating Supply Voltage (V)：2.7
Typical Operating Supply Voltage (V)：3.3
Maximum Operating Supply Voltage (V)：3.6
Programming Voltage (V)：2.7 to 3.6
Program Current (mA)：35
Minimum Operating Temperature (°C)：-40
Maximum Operating Temperature (°C)：85
Supplier Temperature Grade：Industrial
Command Compatible：No
ECC Support：Yes
Support of Page Mode：No
Mounting：Surface Mount
Package Height：0.6(Max)
Package Width：9
Package Length：11
PCB changed：63
Supplier Package：VFBGA
Supply Voltage-Nom (Vsup)：2.7V - 3.6V
Part Status：Active
Type：SLC NAND Flash
Pin Count：63
Speed：40MHz
Architecture：Sectored
Organization：High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set
Memory Density：2Gb
Boot Block：No
Temperature：40ºC ~ 85ºC / -40ºC ~ 105ºC

Со склада 21

Итого $0.00000