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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:292
  • Manufacturer Part Number:IBM25PPC750FX-GR2533T
  • Rohs Code:No
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:IBM MICROELECTRONICS
  • Part Package Code:BGA
  • Package Description:21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292
  • Risk Rank:5.71
  • Clock Frequency-Max:800 MHz
  • Package Body Material:CERAMIC, METAL-SEALED COFIRED
  • Package Code:BGA
  • Package Equivalence Code:BGA292,20X20,40
  • Package Shape:SQUARE
  • Package Style:GRID ARRAY
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • JESD-609 Code:e1
  • Pbfree Code:Yes
  • ECCN Code:3A001.A.3
  • Terminal Finish:TIN SILVER COPPER
  • HTS Code:8542.31.00.01
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Terminal Pitch:1 mm
  • Reach Compliance Code:not_compliant
  • Pin Count:292
  • JESD-30 Code:S-CBGA-B292
  • Qualification Status:Not Qualified
  • Power Supplies:1.45,1.8/3.3 V
  • Speed:800 MHz
  • uPs/uCs/Peripheral ICs Type:MICROPROCESSOR, RISC
  • Bit Size:32
  • Seated Height-Max:2.828 mm
  • Boundary Scan:NO
  • Low Power Mode:NO
  • Format:FIXED POINT
  • Integrated Cache:NO
  • Length:21 mm
  • Width:21 mm

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