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K4J55323QG-AC120
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Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Surface Mount：YES
- Number of Terminals：136
- Manufacturer Part Number：K4J55323QG-AC120
- Rohs Code：No
- Part Life Cycle Code：Obsolete
- Ihs Manufacturer：SAMSUNG SEMICONDUCTOR INC
- Part Package Code：BGA
- Package Description：TFBGA,
- Risk Rank：5.92
- Access Time-Max：0.23 ns
- Number of Words：8388608 words
- Number of Words Code：8000000
- Operating Temperature-Max：85 °C
- Package Body Material：PLASTIC/EPOXY
- Package Code：TFBGA
- Package Shape：RECTANGULAR
- Package Style：GRID ARRAY, THIN PROFILE, FINE PITCH
- Supply Voltage-Nom (Vsup)：1.8 V
- Reflow Temperature-Max (s)：30
- JESD-609 Code：e0
- ECCN Code：EAR99
- Terminal Finish：Tin/Lead (Sn/Pb)
- Additional Feature：AUTO/SELF REFRESH
- HTS Code：8542.32.00.24
- Terminal Position：BOTTOM
- Terminal Form：BALL
- Peak Reflow Temperature (Cel)：240
- Number of Functions：1
- Terminal Pitch：0.8 mm
- Reach Compliance Code：compliant
- Pin Count：136
- JESD-30 Code：R-PBGA-B136
- Qualification Status：Not Qualified
- Supply Voltage-Max (Vsup)：1.9 V
- Temperature Grade：OTHER
- Supply Voltage-Min (Vsup)：1.7 V
- Number of Ports：1
- Operating Mode：SYNCHRONOUS
- Organization：8MX32
- Seated Height-Max：1.2 mm
- Memory Width：32
- Memory Density：268435456 bit
- Memory IC Type：DDR DRAM
- Access Mode：FOUR BANK PAGE BURST
- Self Refresh：YES
- Length：14 mm
- Width：11 mm
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