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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:100
  • Ihs Manufacturer:LAPIS SEMICONDUCTOR CO LTD
  • Package Description:QFP, TQFP100,.63SQ
  • Risk Rank:5.92
  • Operating Temperature-Max:70 °C
  • Operating Temperature-Min:-30 °C
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:QFP
  • Package Equivalence Code:TQFP100,.63SQ
  • Package Shape:SQUARE
  • Package Style:FLATPACK
  • RAM(byte):2048
  • ROM(word):32768
  • Part Life Cycle Code:Obsolete
  • Rohs Code:No
  • Manufacturer Part Number:MSM66P587A
  • JESD-609 Code:e0
  • Terminal Finish:Tin/Lead (Sn/Pb)
  • Terminal Position:QUAD
  • Terminal Form:GULL WING
  • Terminal Pitch:0.5 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:S-PQFP-G100
  • Qualification Status:Not Qualified
  • Power Supplies:3/5 V
  • Temperature Grade:OTHER
  • Speed:20 MHz
  • Supply Current-Max:70 mA
  • Bit Size:16
  • CPU Family:OLMS-66K
  • ROM Programmability:UVPROM

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