Изображение служит лишь для справки
ANXS1750FXC3F
Lagernummer 0
Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Package / Case：Axial
- Surface Mount：NO
- Supplier Device Package：Axial
- Number of Terminals：463
- Package Description：SPGA, SPGA453,37X37
- Package Style：GRID ARRAY, SHRINK PITCH
- Package Body Material：CERAMIC, METAL-SEALED COFIRED
- Package Equivalence Code：SPGA453,37X37
- Supply Voltage-Nom：1.25 V
- Reflow Temperature-Max (s)：NOT SPECIFIED
- Rohs Code：Yes
- Manufacturer Part Number：ANXS1750FXC3F
- Clock Frequency-Max：133 MHz
- Package Code：SPGA
- Package Shape：SQUARE
- Manufacturer：AMD
- Part Life Cycle Code：Obsolete
- Ihs Manufacturer：ADVANCED MICRO DEVICES INC
- Part Package Code：PGA
- Risk Rank：5.82
- Operating Temperature：-65°C ~ 175°C
- Series：Military, MIL-PRF-55182/01, RNC55
- Packaging：Bulk
- Size / Dimension：0.094 Dia x 0.250 L (2.39mm x 6.35mm)
- Tolerance：±0.5%
- Part Status：Active
- Number of Terminations：2
- ECCN Code：3A001.A.3
- Temperature Coefficient：±50ppm/°C
- Resistance：10.5 kOhms
- Composition：Metal Film
- Power (Watts)：0.125W, 1/8W
- HTS Code：8542.31.00.01
- Subcategory：Microprocessors
- Technology：CMOS
- Terminal Position：PERPENDICULAR
- Terminal Form：PIN/PEG
- Peak Reflow Temperature (Cel)：NOT SPECIFIED
- Terminal Pitch：1.27 mm
- Reach Compliance Code：unknown
- Pin Count：463
- JESD-30 Code：S-CPGA-P463
- Qualification Status：Not Qualified
- Failure Rate：S (0.001%)
- Power Supplies：1.25 V
- Speed：1400 MHz
- uPs/uCs/Peripheral ICs Type：MICROPROCESSOR
- Supply Current-Max：50 mA
- Bit Size：32
- Boundary Scan：YES
- Low Power Mode：YES
- External Data Bus Width：64
- Format：FLOATING POINT
- Integrated Cache：YES
- Features：Military, Moisture Resistant, Weldable
- Height Seated (Max)：--
- Width：49.525 mm
- Length：49.525 mm
Со склада 0
Итого $0.00000
Центр поддержки
услуга покупки
пункты договора
Корпорация Whisyee
Контакты