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Спецификация Часто задаваемые вопросы
  • Package / Case:0805 (2012 Metric)
  • Surface Mount:YES
  • Supplier Device Package:0805
  • Number of Terminals:360
  • Package:Tape & Reel (TR)
  • Base Product Number:SG73P2
  • Mfr:KOA Speer Electronics, Inc.
  • Product Status:Active
  • Package Description:25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360
  • Package Style:GRID ARRAY
  • Moisture Sensitivity Levels:1
  • Package Body Material:CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Nom:1.1 V
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Supply Voltage-Min:1.05 V
  • Rohs Code:No
  • Manufacturer Part Number:MC7447RX867NB
  • Clock Frequency-Max:167 MHz
  • Package Code:BGA
  • Package Shape:SQUARE
  • Manufacturer:Motorola Semiconductor Products
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:MOTOROLA INC
  • Supply Voltage-Max:1.15 V
  • Risk Rank:5.8
  • Operating Temperature:-55°C ~ 155°C
  • Series:SG73P
  • Size / Dimension:0.079 L x 0.049 W (2.00mm x 1.25mm)
  • Tolerance:±0.5%
  • Number of Terminations:2
  • ECCN Code:3A001.A.3
  • Temperature Coefficient:±100ppm/°C
  • Resistance:140 kOhms
  • Composition:Thick Film
  • Power (Watts):0.25W, 1/4W
  • HTS Code:8542.31.00.01
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):225
  • Terminal Pitch:1.27 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:S-CBGA-B360
  • Qualification Status:Not Qualified
  • Failure Rate:-
  • Speed:867 MHz
  • uPs/uCs/Peripheral ICs Type:MICROPROCESSOR, RISC
  • Bit Size:32
  • Seated Height-Max:3.2 mm
  • Address Bus Width:36
  • Boundary Scan:YES
  • Low Power Mode:YES
  • External Data Bus Width:64
  • Format:FLOATING POINT
  • Integrated Cache:YES
  • Features:Automotive AEC-Q200, Pulse Withstanding
  • Height Seated (Max):0.024 (0.60mm)
  • Width:25 mm
  • Length:25 mm
  • Ratings:AEC-Q200

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