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Спецификация Часто задаваемые вопросы
  • Surface Mount:NO
  • Number of Terminals:24
  • Package Description:DIP, DIP24,.6
  • Package Style:IN-LINE
  • Number of Words Code:16000
  • Package Body Material:CERAMIC
  • Package Equivalence Code:DIP24,.6
  • Operating Temperature-Min:-55 °C
  • Access Time-Max:70 ns
  • Operating Temperature-Max:125 °C
  • Rohs Code:No
  • Manufacturer Part Number:MAL9167CBBAF
  • Number of Words:16384 words
  • Supply Voltage-Nom (Vsup):5 V
  • Package Code:DIP
  • Package Shape:RECTANGULAR
  • Manufacturer:Plessey Semiconductors Ltd
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:GEC PLESSEY SEMICONDUCTORS
  • Risk Rank:5.92
  • Usage Level:Military grade
  • JESD-609 Code:e0
  • Terminal Finish:Tin/Lead (Sn/Pb)
  • Subcategory:SRAMs
  • Technology:CMOS
  • Terminal Position:DUAL
  • Terminal Form:THROUGH-HOLE
  • Terminal Pitch:2.54 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:R-XDIP-T24
  • Qualification Status:Not Qualified
  • Power Supplies:5 V
  • Temperature Grade:MILITARY
  • Operating Mode:ASYNCHRONOUS
  • Supply Current-Max:0.03 mA
  • Organization:16KX1
  • Output Characteristics:3-STATE
  • Memory Width:1
  • Standby Current-Max:0.001 A
  • Memory Density:16384 bit
  • Screening Level:38535Q/M;38534H;883B
  • Parallel/Serial:PARALLEL
  • I/O Type:SEPARATE
  • Memory IC Type:STANDARD SRAM
  • Standby Voltage-Min:2 V
  • Total Dose:30k Rad(Si) V

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