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AM29LV033C90WDI
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Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Package / Case:Axial
- Surface Mount:YES
- Supplier Device Package:Axial
- Number of Terminals:63
- Package Description:TFBGA,
- Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH
- Moisture Sensitivity Levels:3
- Number of Words Code:4000000
- Package Body Material:PLASTIC/EPOXY
- Operating Temperature-Min:-40 °C
- Reflow Temperature-Max (s):30
- Access Time-Max:90 ns
- Operating Temperature-Max:85 °C
- Rohs Code:No
- Manufacturer Part Number:AM29LV033C90WDI
- Number of Words:4194304 words
- Supply Voltage-Nom (Vsup):3 V
- Package Code:TFBGA
- Package Shape:RECTANGULAR
- Manufacturer:Spansion
- Part Life Cycle Code:Obsolete
- Ihs Manufacturer:SPANSION INC
- Risk Rank:5.4
- Part Package Code:BGA
- Operating Temperature:-65°C ~ 175°C
- Series:Military, MIL-PRF-55182/07, RNC50
- Packaging:Tape & Reel (TR)
- Size / Dimension:0.070 Dia x 0.150 L (1.78mm x 3.81mm)
- Tolerance:±0.1%
- JESD-609 Code:e0
- Pbfree Code:No
- Part Status:Active
- Number of Terminations:2
- Temperature Coefficient:±25ppm/°C
- Resistance:1 kOhms
- Terminal Finish:TIN LEAD
- Composition:Metal Film
- Power (Watts):0.1W, 1/10W
- Additional Feature:MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
- Technology:CMOS
- Terminal Position:BOTTOM
- Terminal Form:BALL
- Peak Reflow Temperature (Cel):240
- Number of Functions:1
- Terminal Pitch:0.8 mm
- Reach Compliance Code:compliant
- Pin Count:63
- JESD-30 Code:R-PBGA-B63
- Qualification Status:Not Qualified
- Failure Rate:S (0.001%)
- Supply Voltage-Max (Vsup):3.6 V
- Temperature Grade:INDUSTRIAL
- Supply Voltage-Min (Vsup):2.7 V
- Operating Mode:ASYNCHRONOUS
- Organization:4MX8
- Seated Height-Max:1.2 mm
- Memory Width:8
- Memory Density:33554432 bit
- Parallel/Serial:PARALLEL
- Memory IC Type:FLASH
- Programming Voltage:3 V
- Features:Military, Moisture Resistant, Weldable
- Height Seated (Max):--
- Width:8 mm
- Length:14 mm
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