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Спецификация Часто задаваемые вопросы
  • Mounting Type:Through Hole
  • Package / Case:DO-214AB, SMC
  • Supplier Device Package:DO-214AB (SMC)
  • Housing Material:Polyamide (PA66), Nylon 6/6
  • Contact Material - Plating:Brass - Copper Tin Plated
  • Clamp Material - Plating:Steel, Stainless
  • Screw Material - Plating:Steel, Galvanized - Chromate Plated
  • Torque-Screw:0.51 Nm (4.5 Lb-In)
  • Package:Tape & Reel (TR)
  • Mfr:Taiwan Semiconductor Corporation
  • Product Status:Discontinued at Digi-Key
  • Operating Temperature:-55°C ~ 105°C
  • Series:Buchanan
  • Packaging:Bulk
  • Part Status:Obsolete
  • Color:Black
  • Pitch:0.197 (5.00mm)
  • Wire Gauge:14-22 AWG
  • Voltage:300V
  • Number of Levels:1
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Current:10A
  • Diode Type:Standard
  • Current - Reverse Leakage @ Vr:10 µA @ 600 V
  • Voltage - Forward (Vf) (Max) @ If:1.15 V @ 4 A
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Positions Per Level:3
  • Voltage - DC Reverse (Vr) (Max):600 V
  • Current - Average Rectified (Io):4A
  • Mating Orientation:Horizontal with Board
  • Wire Termination:Screw - Leaf Spring, Wire Guard
  • Screw Thread:M2.6
  • Capacitance @ Vr, F:60pF @ 4V, 1MHz
  • Reverse Recovery Time (trr):1.5 µs
  • Features:Interlocking (Side)

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