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Lagernummer 1607

Zwischensummenbetrag $0.00000

Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:26
  • Package Description:HSSOP, SOP32,.3,32
  • Package Style:SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:SOP32,.3,32
  • Operating Temperature-Min:-25 °C
  • Reflow Temperature-Max (s):10
  • Operating Temperature-Max:60 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:BA6569AFP-E2
  • Package Code:HSSOP
  • Package Shape:RECTANGULAR
  • Manufacturer:ROHM Semiconductor
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:ROHM CO LTD
  • Risk Rank:5.03
  • Part Package Code:SOIC
  • JESD-609 Code:e3/e2
  • Pbfree Code:Yes
  • Terminal Finish:TIN/TIN COPPER
  • HTS Code:8542.39.00.01
  • Subcategory:Other Telecom ICs
  • Technology:BIPOLAR
  • Terminal Position:DUAL
  • Terminal Form:GULL WING
  • Peak Reflow Temperature (Cel):260
  • Number of Functions:1
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • Pin Count:24
  • JESD-30 Code:R-PDSO-G26
  • Qualification Status:Not Qualified
  • Power Supplies:3.3/7.4 V
  • Temperature Grade:OTHER
  • Supply Current-Max:0.12 mA
  • Seated Height-Max:2.11 mm
  • Telecom IC Type:TELEPHONE SPEECH CIRCUIT
  • Width:5.4 mm
  • Length:13.6 mm

Со склада 1607

Итого $0.00000