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Lagernummer 0

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Спецификация Часто задаваемые вопросы
  • Mounting Type:Panel Mount, Through Hole
  • Surface Mount:YES
  • Mounting Feature:Flange
  • Shell Material:Aluminum
  • Number of Terminals:24
  • Package:Retail Package
  • Primary Material:Metal
  • Mfr:Glenair
  • Product Status:Active
  • Contact Materials:Copper Alloy
  • Contact Finish Mating:Gold
  • Package Description:DFP, FL24,.4
  • Package Style:FLATPACK
  • Number of Words Code:512
  • Package Body Material:CERAMIC
  • Package Equivalence Code:FL24,.4
  • Operating Temperature-Min:-55 °C
  • Access Time-Max:45 ns
  • Operating Temperature-Max:125 °C
  • Rohs Code:No
  • Manufacturer Part Number:AM27S31AFM
  • Number of Words:512 words
  • Supply Voltage-Nom (Vsup):5 V
  • Package Code:DFP
  • Package Shape:RECTANGULAR
  • Manufacturer:AMD
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:ADVANCED MICRO DEVICES INC
  • Risk Rank:5.92
  • Usage Level:Military grade
  • Operating Temperature:-65°C ~ 175°C
  • Series:806
  • JESD-609 Code:e0
  • Termination:Solder
  • Connector Type:Receptacle, Female Sockets
  • Terminal Finish:Tin/Lead (Sn/Pb)
  • Color:Silver
  • Fastening Type:Threaded
  • Subcategory:OTP ROMs
  • Technology:TTL
  • Terminal Position:DUAL
  • Orientation:B
  • Terminal Form:FLAT
  • Terminal Pitch:1.27 mm
  • Reach Compliance Code:unknown
  • Shell Finish:Electroless Nickel
  • Shell Size - Insert:33-97
  • JESD-30 Code:R-XDFP-F24
  • Qualification Status:Not Qualified
  • Power Supplies:5 V
  • Temperature Grade:MILITARY
  • Supply Current-Max:0.175 mA
  • Organization:512X8
  • Memory Width:8
  • Memory Density:4096 bit
  • Screening Level:MIL-STD-883 Class C
  • Memory IC Type:OTP ROM
  • Features:Ground

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