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AM27S31AFM
- AMD
- Неклассифицированные
- -
- DFP, FL24,.4
- Date Sheet
Lagernummer 0
Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Mounting Type:Panel Mount, Through Hole
- Surface Mount:YES
- Mounting Feature:Flange
- Shell Material:Aluminum
- Number of Terminals:24
- Package:Retail Package
- Primary Material:Metal
- Mfr:Glenair
- Product Status:Active
- Contact Materials:Copper Alloy
- Contact Finish Mating:Gold
- Package Description:DFP, FL24,.4
- Package Style:FLATPACK
- Number of Words Code:512
- Package Body Material:CERAMIC
- Package Equivalence Code:FL24,.4
- Operating Temperature-Min:-55 °C
- Access Time-Max:45 ns
- Operating Temperature-Max:125 °C
- Rohs Code:No
- Manufacturer Part Number:AM27S31AFM
- Number of Words:512 words
- Supply Voltage-Nom (Vsup):5 V
- Package Code:DFP
- Package Shape:RECTANGULAR
- Manufacturer:AMD
- Part Life Cycle Code:Obsolete
- Ihs Manufacturer:ADVANCED MICRO DEVICES INC
- Risk Rank:5.92
- Usage Level:Military grade
- Operating Temperature:-65°C ~ 175°C
- Series:806
- JESD-609 Code:e0
- Termination:Solder
- Connector Type:Receptacle, Female Sockets
- Terminal Finish:Tin/Lead (Sn/Pb)
- Color:Silver
- Fastening Type:Threaded
- Subcategory:OTP ROMs
- Technology:TTL
- Terminal Position:DUAL
- Orientation:B
- Terminal Form:FLAT
- Terminal Pitch:1.27 mm
- Reach Compliance Code:unknown
- Shell Finish:Electroless Nickel
- Shell Size - Insert:33-97
- JESD-30 Code:R-XDFP-F24
- Qualification Status:Not Qualified
- Power Supplies:5 V
- Temperature Grade:MILITARY
- Supply Current-Max:0.175 mA
- Organization:512X8
- Memory Width:8
- Memory Density:4096 bit
- Screening Level:MIL-STD-883 Class C
- Memory IC Type:OTP ROM
- Features:Ground
Со склада 0
Итого $0.00000