Изображение служит лишь для справки

Lagernummer 0

Zwischensummenbetrag $0.00000

Спецификация Часто задаваемые вопросы
  • Mounting Type:Panel Mount, Through Hole
  • Surface Mount:YES
  • Mounting Feature:Flange
  • Shell Material:Stainless Steel
  • Number of Terminals:128
  • Package:Retail Package
  • Primary Material:Metal
  • Mfr:Glenair
  • Product Status:Active
  • Contact Materials:Copper Alloy
  • Contact Finish Mating:Gold
  • Package Description:QFP, TQFP128,.63SQ,16
  • Package Style:FLATPACK
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:TQFP128,.63SQ,16
  • Access Time-Max:6.5 ns
  • Operating Temperature-Max:70 °C
  • Manufacturer Part Number:MS81V32322-66TB
  • Supply Voltage-Nom (Vsup):3.3 V
  • Package Code:QFP
  • Package Shape:SQUARE
  • Manufacturer:LAPIS Semiconductor Co Ltd
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:LAPIS SEMICONDUCTOR CO LTD
  • Risk Rank:5.82
  • Operating Temperature:-65°C ~ 175°C
  • Series:806
  • Termination:Solder
  • Connector Type:Receptacle, Female Sockets
  • Color:Silver
  • Fastening Type:Threaded
  • Subcategory:Other Memory ICs
  • Terminal Position:QUAD
  • Orientation:C
  • Terminal Form:GULL WING
  • Terminal Pitch:0.4 mm
  • Reach Compliance Code:unknown
  • Shell Finish:Passivated
  • JESD-30 Code:S-PQFP-G128
  • Qualification Status:Not Qualified
  • Power Supplies:3.3 V
  • Temperature Grade:COMMERCIAL
  • Supply Current-Max:0.16 mA
  • Standby Current-Max:0.02 A
  • Memory Density:33554432 bit
  • Features:Ground

Со склада 0

Итого $0.00000