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MT58L128L18FF8.5
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Cypress
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Неклассифицированные
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- FBGA-165
Date Sheet
Lagernummer 0
Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Surface Mount：YES
- Number of Terminals：165
- Factory Pack QuantityFactory Pack Quantity：50
- Manufacturer：Maxim Integrated
- Brand：Maxim Integrated
- RoHS：Details
- Package Description：FBGA-165
- Package Style：GRID ARRAY, THIN PROFILE
- Moisture Sensitivity Levels：3
- Number of Words Code：128000
- Package Body Material：PLASTIC/EPOXY
- Reflow Temperature-Max (s)：NOT SPECIFIED
- Access Time-Max：8.5 ns
- Operating Temperature-Max：70 °C
- Rohs Code：No
- Manufacturer Part Number：MT58L128L18FF8.5
- Number of Words：131072 words
- Supply Voltage-Nom (Vsup)：3.3 V
- Package Code：TBGA
- Package Shape：RECTANGULAR
- Part Life Cycle Code：Active
- Ihs Manufacturer：CYPRESS SEMICONDUCTOR CORP
- Risk Rank：5.34
- Part Package Code：BGA
- JESD-609 Code：e0
- Pbfree Code：No
- Terminal Finish：TIN LEAD
- Subcategory：Interface ICs
- Technology：CMOS
- Terminal Position：BOTTOM
- Terminal Form：BALL
- Peak Reflow Temperature (Cel)：220
- Number of Functions：1
- Terminal Pitch：1 mm
- Reach Compliance Code：compliant
- Pin Count：165
- JESD-30 Code：R-PBGA-B165
- Qualification Status：Not Qualified
- Supply Voltage-Max (Vsup)：3.6 V
- Temperature Grade：COMMERCIAL
- Supply Voltage-Min (Vsup)：3.135 V
- Operating Mode：SYNCHRONOUS
- Organization：128KX18
- Seated Height-Max：1.2 mm
- Memory Width：18
- Product Type：Digital Isolators
- Memory Density：2359296 bit
- Parallel/Serial：PARALLEL
- Memory IC Type：STANDARD SRAM
- Product Category：Digital Isolators
- Width：13 mm
- Length：15 mm
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