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508-AG11D-ES
- TE Connectivity AMP Connectors
- Гнезда для ИС, транзисторов
- -
- IC & Component Sockets SOLID FRAME PC 8P
- Date Sheet
Lagernummer 9860
Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Lifecycle Status:ACTIVE (Last Updated: 3 days ago)
- Factory Lead Time:8 Weeks
- Mount:Vertical
- Mounting Type:Through Hole
- Housing Material:Polyester
- Number of Positions or Pins (Grid):8 (2 x 4)
- Contact Material - Mating:Copper Alloy
- Contact Material - Post:Copper Alloy
- Circuit Applications:Signal
- Contact Finish Mating:Gold
- Contact Materials:Copper
- Voltage Rated:1kV
- Operating Temperature:-55°C~105°C
- Packaging:Tube
- Series:500
- Published:2002
- JESD-609 Code:e0
- Pbfree Code:no
- Part Status:Active
- Moisture Sensitivity Level (MSL):1 (Unlimited)
- Termination:Solder
- ECCN Code:EAR99
- Type:DIP, 0.3 (7.62mm) Row Spacing
- Number of Rows:2
- Gender:Female
- Additional Feature:STANDARD: UL 94V-0
- Voltage - Rated DC:1kV
- Orientation:Straight
- Reach Compliance Code:not_compliant
- Current Rating:3A
- Pitch - Mating:0.100 2.54mm
- Lead Pitch:2.54mm
- Number of Contacts:8
- Contact Finish - Post:Tin-Lead
- PCB Contact Pattern:RECTANGULAR
- Body Breadth:0.4 inch
- Lead Length:3.18mm
- Contact Style:RND PIN-SKT
- Contact Resistance:10mOhm
- Insulation Resistance:5GOhm
- Row Spacing:7.62 mm
- Mating Contact Pitch:0.1 inch
- Dielectric Withstanding Voltage:1400VAC V
- Termination Post Length:0.125 3.18mm
- Pitch - Post:0.100 2.54mm
- Features:Closed Frame
- Length:10.16mm
- Plating Thickness:635 nm
- Contact Finish Thickness - Mating:25.0μin 0.63μm
- Material Flammability Rating:UL94 V-0
- RoHS Status:Non-RoHS Compliant
Со склада 9860
Итого $0.00000