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1825108-2
-
TE Connectivity AMP Connectors
-
Гнезда для ИС, транзисторов
- DIP
- CONN IC DIP SOCKET 28POS GOLD
Date Sheet
Lagernummer 0
Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Factory Lead Time：51 Weeks
- Contact Plating：Tin
- Package / Case：DIP
- Mounting Type：Through Hole
- Mount：Vertical
- Housing Material：Thermoplastic, Glass Filled
- Body Material：Thermoplastic
- Number of Positions or Pins (Grid)：28 (2 x 14)
- Contact Material - Mating：Phosphor Bronze
- Contact Material - Post：Phosphor Bronze
- Contact Finish Mating：Gold
- Contact Materials：Bronze
- Published：2005
- Series：Diplomate DL
- Packaging：Tube
- Operating Temperature：-55°C~125°C
- JESD-609 Code：e3
- Pbfree Code：yes
- Part Status：Obsolete
- Moisture Sensitivity Level (MSL)：1 (Unlimited)
- Termination：Solder
- ECCN Code：EAR99
- Type：DIP, 0.6 (15.24mm) Row Spacing
- Number of Positions：28
- Color：Black
- Number of Rows：2
- HTS Code：8536.69.40.40
- Orientation：Straight
- Pitch - Mating：0.100 2.54mm
- Approval Agency：CSA, UL
- Number of Contacts：28
- Lead Length：3.25mm
- Contact Resistance：30mOhm
- Insulation Resistance：10GOhm
- Row Spacing：15.49 mm
- ELV：Compliant
- Termination Post Length：0.128 3.24mm
- Pitch - Post：0.100 2.54mm
- Features：Closed Frame
- Width：17.6mm
- Length：35.4mm
- Contact Finish Thickness - Mating：15.0μin 0.38μm
- Contact Finish Thickness - Post：15.0μin 0.38μm
- RoHS Status：RoHS Compliant
- Radiation Hardening：No
- Material Flammability Rating：UL94 V-0
- Flammability Rating：UL94 V-0
- Lead Free：Lead Free
Со склада 0
Итого $0.00000
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Корпорация Whisyee
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