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H5TQ1G63EFR-PBI
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Zwischensummenbetrag $0.00000
Спецификация Часто задаваемые вопросы
- Surface Mount：YES
- Number of Terminals：96
- Package Description：TFBGA,
- Package Style：GRID ARRAY, THIN PROFILE, FINE PITCH
- Number of Words Code：64000000
- Package Body Material：PLASTIC/EPOXY
- Operating Temperature-Min：-40 °C
- Reflow Temperature-Max (s)：NOT SPECIFIED
- Operating Temperature-Max：85 °C
- Rohs Code：Yes
- Manufacturer Part Number：H5TQ1G63EFR-PBI
- Number of Words：67108864 words
- Supply Voltage-Nom (Vsup)：1.5 V
- Package Code：TFBGA
- Package Shape：RECTANGULAR
- Manufacturer：SK Hynix Inc
- Part Life Cycle Code：Obsolete
- Ihs Manufacturer：SK HYNIX INC
- Risk Rank：5.8
- Part Package Code：BGA
- ECCN Code：EAR99
- Additional Feature：AUTO/SELF REFRESH
- HTS Code：8542.32.00.32
- Technology：CMOS
- Terminal Position：BOTTOM
- Terminal Form：BALL
- Peak Reflow Temperature (Cel)：NOT SPECIFIED
- Number of Functions：1
- Terminal Pitch：0.8 mm
- Reach Compliance Code：compliant
- Pin Count：96
- JESD-30 Code：R-PBGA-B96
- Supply Voltage-Max (Vsup)：1.575 V
- Temperature Grade：INDUSTRIAL
- Supply Voltage-Min (Vsup)：1.425 V
- Number of Ports：1
- Operating Mode：SYNCHRONOUS
- Organization：64MX16
- Seated Height-Max：1.2 mm
- Memory Width：16
- Memory Density：1073741824 bit
- Memory IC Type：DDR DRAM
- Access Mode：MULTI BANK PAGE BURST
- Self Refresh：YES
- Width：7.5 mm
- Length：13 mm
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