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  • Surface Mount:YES
  • Number of Terminals:107
  • Package Description:FBGA-107
  • Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH
  • Number of Words Code:16000000
  • Package Body Material:PLASTIC/EPOXY
  • Operating Temperature-Min:-30 °C
  • Operating Temperature-Max:85 °C
  • Manufacturer Part Number:HYC0UEE0AF2P-3SH0E
  • Number of Words:16777216 words
  • Supply Voltage-Nom (Vsup):1.8 V
  • Package Code:TFBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:SK Hynix Inc
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:SK HYNIX INC
  • Risk Rank:5.63
  • Additional Feature:IT ALSO CONTAINS 512MBIT(64MBIT X 8) NAND FLASH OPERATES AT 2.7V NOM SUPPLY
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Number of Functions:1
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PBGA-B107
  • Supply Voltage-Max (Vsup):1.95 V
  • Temperature Grade:OTHER
  • Supply Voltage-Min (Vsup):1.7 V
  • Operating Mode:SYNCHRONOUS
  • Organization:16MX16
  • Seated Height-Max:1.2 mm
  • Memory Width:16
  • Memory Density:268435456 bit
  • Memory IC Type:MEMORY CIRCUIT
  • Width:10.5 mm
  • Length:13 mm

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