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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:68
  • Package Description:FBGA, BGA68,9X19,32
  • Package Style:GRID ARRAY, FINE PITCH
  • Number of Words Code:512000000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA68,9X19,32
  • Access Time-Max:0.45 ns
  • Operating Temperature-Max:95 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:K4T2G044QA-HLE6
  • Clock Frequency-Max (fCLK):333 MHz
  • Number of Words:536870912 words
  • Supply Voltage-Nom (Vsup):1.8 V
  • Package Code:FBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:Samsung Semiconductor
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:SAMSUNG SEMICONDUCTOR INC
  • Risk Rank:5.75
  • Subcategory:DRAMs
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PBGA-B68
  • Qualification Status:Not Qualified
  • Power Supplies:1.8 V
  • Temperature Grade:OTHER
  • Supply Current-Max:0.32 mA
  • Organization:512MX4
  • Output Characteristics:3-STATE
  • Memory Width:4
  • Standby Current-Max:0.008 A
  • Memory Density:2147483648 bit
  • I/O Type:COMMON
  • Memory IC Type:DDR DRAM
  • Refresh Cycles:8192
  • Sequential Burst Length:4,8
  • Interleaved Burst Length:4,8

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