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Lagernummer 0

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:90
  • Package Description:TFBGA, BGA90,9X15,32
  • Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH
  • Number of Words Code:512000
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA90,9X15,32
  • Reflow Temperature-Max (s):NOT SPECIFIED
  • Access Time-Max:5 ns
  • Operating Temperature-Max:70 °C
  • Rohs Code:Yes
  • Manufacturer Part Number:W9864G2IB-6
  • Clock Frequency-Max (fCLK):166 MHz
  • Number of Words:524288 words
  • Supply Voltage-Nom (Vsup):3.3 V
  • Package Code:TFBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:Winbond Electronics Corp
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:WINBOND ELECTRONICS CORP
  • Risk Rank:5.63
  • Part Package Code:BGA
  • ECCN Code:EAR99
  • Additional Feature:AUTO/SELF REFRESH
  • HTS Code:8542.32.00.02
  • Subcategory:DRAMs
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Number of Functions:1
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • Pin Count:90
  • JESD-30 Code:R-PBGA-B90
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):3.6 V
  • Power Supplies:3.3 V
  • Temperature Grade:COMMERCIAL
  • Supply Voltage-Min (Vsup):3 V
  • Number of Ports:1
  • Operating Mode:SYNCHRONOUS
  • Supply Current-Max:0.14 mA
  • Organization:512KX32
  • Output Characteristics:3-STATE
  • Seated Height-Max:1.2 mm
  • Memory Width:32
  • Standby Current-Max:0.002 A
  • Memory Density:16777216 bit
  • I/O Type:COMMON
  • Memory IC Type:SYNCHRONOUS DRAM
  • Refresh Cycles:4096
  • Sequential Burst Length:1,2,4,8,FP
  • Interleaved Burst Length:1,2,4,8
  • Access Mode:FOUR BANK PAGE BURST
  • Self Refresh:YES
  • Width:8 mm
  • Length:13 mm

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