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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:108
  • Package Description:FBGA, BGA108,14X14,20
  • Package Style:GRID ARRAY, FINE PITCH
  • Package Body Material:PLASTIC/EPOXY
  • Package Equivalence Code:BGA108,14X14,20
  • Operating Temperature-Min:-20 °C
  • Operating Temperature-Max:70 °C
  • Manufacturer Part Number:W99685F
  • Package Code:FBGA
  • Package Shape:SQUARE
  • Manufacturer:Winbond Electronics Corp
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:WINBOND ELECTRONICS CORP
  • Risk Rank:5.82
  • Subcategory:Other Consumer ICs
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Terminal Pitch:0.5 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:S-PBGA-B108
  • Qualification Status:Not Qualified
  • Power Supplies:1.8,2.8 V
  • Temperature Grade:COMMERCIAL
  • Consumer IC Type:CONSUMER CIRCUIT

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