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  • Lifecycle Status:IN PRODUCTION (Last Updated: 3 weeks ago)
  • Factory Lead Time:17 Weeks
  • Mount:Surface Mount
  • Mounting Type:Surface Mount
  • Package / Case:SQ-MELF, A
  • Number of Pins:2
  • Diode Element Material:SILICON
  • Number of Elements:1
  • Packaging:Bulk
  • Published:1997
  • JESD-609 Code:e0
  • Pbfree Code:no
  • Part Status:Active
  • Moisture Sensitivity Level (MSL):1 (Unlimited)
  • Number of Terminations:2
  • ECCN Code:EAR99
  • Terminal Finish:Tin/Lead (Sn/Pb)
  • Max Operating Temperature:150°C
  • Min Operating Temperature:-65°C
  • Applications:HIGH VOLTAGE ULTRA FAST RECOVERY
  • Additional Feature:METALLURGICALLY BONDED
  • HTS Code:8541.10.00.80
  • Terminal Position:END
  • Terminal Form:WRAP AROUND
  • Peak Reflow Temperature (Cel):NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s):NOT SPECIFIED
  • Pin Count:2
  • Qualification Status:Not Qualified
  • Element Configuration:Single
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Diode Type:Standard
  • Current - Reverse Leakage @ Vr:2μA @ 220V
  • Voltage - Forward (Vf) (Max) @ If:1.35V @ 2A
  • Case Connection:ISOLATED
  • Forward Current:1.75A
  • Operating Temperature - Junction:-65°C~150°C
  • Output Current-Max:4A
  • Forward Voltage:1.5V
  • Max Reverse Voltage (DC):220V
  • Average Rectified Current:1.75A
  • Number of Phases:1
  • Reverse Recovery Time:30 ns
  • Peak Reverse Current:2μA
  • Max Repetitive Reverse Voltage (Vrrm):220V
  • Capacitance @ Vr, F:40pF @ 10V 1MHz
  • Peak Non-Repetitive Surge Current:75A
  • Radiation Hardening:Yes
  • RoHS Status:Non-RoHS Compliant

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