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SDIN5C2-8G-L

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:169
  • Rohs Code:Yes
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:SANDISK CORP
  • Package Description:TFBGA-169
  • Moisture Sensitivity Levels:3
  • Number of Words:8589934592 words
  • Number of Words Code:8000000000
  • Operating Temperature-Max:85 °C
  • Operating Temperature-Min:-25 °C
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:VFBGA
  • Package Shape:RECTANGULAR
  • Package Style:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup):3.3 V
  • Pbfree Code:Yes
  • ECCN Code:EAR99
  • Type:MLC NAND TYPE
  • HTS Code:8542.32.00.51
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Number of Functions:1
  • Terminal Pitch:0.5 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:R-PBGA-B169
  • Supply Voltage-Max (Vsup):3.6 V
  • Temperature Grade:OTHER
  • Supply Voltage-Min (Vsup):2.7 V
  • Operating Mode:SYNCHRONOUS
  • Organization:8GX8
  • Seated Height-Max:1 mm
  • Memory Width:8
  • Memory Density:68719476736 bit
  • Parallel/Serial:PARALLEL
  • Memory IC Type:FLASH
  • Programming Voltage:3.3 V
  • Length:16 mm
  • Width:12 mm

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