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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:625
  • Rohs Code:Yes
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:ADVANCED MICRO DEVICES INC
  • Package Description:BGA-625
  • Moisture Sensitivity Levels:4
  • Operating Temperature-Max:100 °C
  • Operating Temperature-Min:-40 °C
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:FBGA
  • Package Equivalence Code:BGA625,25X25,32
  • Package Shape:SQUARE
  • Package Style:GRID ARRAY, FINE PITCH
  • Supply Voltage-Max:0.742 V
  • Supply Voltage-Min:0.698 V
  • Supply Voltage-Nom:0.72 V
  • JESD-609 Code:e1
  • Terminal Finish:TIN SILVER COPPER
  • Additional Feature:ALSO OPERATES AT 0.85V NOMINAL SUPPLY
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):250
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • Time@Peak Reflow Temperature-Max (s):30
  • JESD-30 Code:S-PBGA-B625
  • Temperature Grade:INDUSTRIAL
  • uPs/uCs/Peripheral ICs Type:PROGRAMMABLE SoC
  • Seated Height-Max:3.43 mm
  • Bus Compatibility:I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
  • Length:21 mm
  • Width:21 mm

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