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MD3331-D64-V3-X-P

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:107
  • Rohs Code:Yes
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:M-SYSTEMS CORP
  • Package Description:FBGA, BGA107,10X12,32
  • Access Time-Max:70 ns
  • Operating Temperature-Max:85 °C
  • Operating Temperature-Min:-40 °C
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:FBGA
  • Package Equivalence Code:BGA107,10X12,32
  • Package Shape:RECTANGULAR
  • Package Style:GRID ARRAY, FINE PITCH
  • Supply Voltage-Nom (Vsup):3.3 V
  • ECCN Code:EAR99
  • HTS Code:8542.32.00.71
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):260
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:R-PBGA-B107
  • Qualification Status:Not Qualified
  • Temperature Grade:INDUSTRIAL
  • Supply Current-Max:0.09 mA
  • Standby Current-Max:0.00008 A
  • Memory IC Type:MEMORY CIRCUIT
  • Mixed Memory Type:FLASH+PSRAM

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