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K4B1G0446E-HCF8

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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:78
  • Rohs Code:Yes
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:SAMSUNG SEMICONDUCTOR INC
  • Access Time-Max:0.15 ns
  • Clock Frequency-Max (fCLK):533 MHz
  • Moisture Sensitivity Levels:3
  • Number of Words:268435456 words
  • Number of Words Code:256000000
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:FBGA
  • Package Equivalence Code:BGA78,9X13,32
  • Package Shape:RECTANGULAR
  • Package Style:GRID ARRAY, FINE PITCH
  • Supply Voltage-Nom (Vsup):1.5 V
  • JESD-609 Code:e1
  • Pbfree Code:Yes
  • ECCN Code:EAR99
  • Terminal Finish:TIN SILVER COPPER
  • HTS Code:8542.32.00.32
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):260
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:unknown
  • JESD-30 Code:R-PBGA-B78
  • Qualification Status:Not Qualified
  • Supply Current-Max:0.18 mA
  • Organization:256MX4
  • Output Characteristics:3-STATE
  • Memory Width:4
  • Memory Density:1073741824 bit
  • I/O Type:COMMON
  • Memory IC Type:DDR3 DRAM
  • Refresh Cycles:8192
  • Sequential Burst Length:4,8
  • Interleaved Burst Length:4,8

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