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  • Surface Mount:YES
  • Number of Terminals:78
  • Rohs Code:Yes
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:INTEGRATED SILICON SOLUTION INC
  • Package Description:TFBGA,
  • Date Of Intro:2017-09-18
  • Moisture Sensitivity Levels:3
  • Number of Words:1073741824 words
  • Number of Words Code:1000000000
  • Operating Temperature-Max:95 °C
  • Operating Temperature-Min:-40 °C
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:TFBGA
  • Package Shape:RECTANGULAR
  • Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup):1.5 V
  • JESD-609 Code:e1
  • ECCN Code:EAR99
  • Terminal Finish:Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature:AUTO/SELF REFRESH
  • HTS Code:8542.32.00.36
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Peak Reflow Temperature (Cel):260
  • Number of Functions:1
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:compliant
  • Time@Peak Reflow Temperature-Max (s):10
  • JESD-30 Code:R-PBGA-B78
  • Supply Voltage-Max (Vsup):1.575 V
  • Temperature Grade:INDUSTRIAL
  • Supply Voltage-Min (Vsup):1.425 V
  • Number of Ports:1
  • Operating Mode:SYNCHRONOUS
  • Organization:1GX8
  • Seated Height-Max:1.2 mm
  • Memory Width:8
  • Memory Density:8589934592 bit
  • Memory IC Type:DDR3 DRAM
  • Access Mode:MULTI BANK PAGE BURST
  • Self Refresh:YES
  • Length:14 mm
  • Width:10 mm

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