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HYB18T512160B2C-3S

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Zwischensummenbetrag $0.00000

Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:84
  • Rohs Code:No
  • Part Life Cycle Code:Obsolete
  • Ihs Manufacturer:QIMONDA AG
  • Part Package Code:BGA
  • Package Description:TFBGA, BGA84,9X15,32
  • Access Time-Max:0.45 ns
  • Clock Frequency-Max (fCLK):333 MHz
  • Moisture Sensitivity Levels:3
  • Number of Words:33554432 words
  • Number of Words Code:32000000
  • Operating Temperature-Max:70 °C
  • Package Body Material:PLASTIC/EPOXY
  • Package Code:TFBGA
  • Package Equivalence Code:BGA84,9X15,32
  • Package Shape:RECTANGULAR
  • Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup):1.8 V
  • ECCN Code:EAR99
  • Additional Feature:AUTO/SELF REFRESH
  • HTS Code:8542.32.00.28
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Number of Functions:1
  • Terminal Pitch:0.8 mm
  • Reach Compliance Code:unknown
  • Pin Count:84
  • JESD-30 Code:R-PBGA-B84
  • Qualification Status:Not Qualified
  • Supply Voltage-Max (Vsup):1.9 V
  • Temperature Grade:COMMERCIAL
  • Supply Voltage-Min (Vsup):1.7 V
  • Number of Ports:1
  • Operating Mode:SYNCHRONOUS
  • Supply Current-Max:0.218 mA
  • Organization:32MX16
  • Output Characteristics:3-STATE
  • Seated Height-Max:1.2 mm
  • Memory Width:16
  • Standby Current-Max:0.003 A
  • Memory Density:536870912 bit
  • I/O Type:COMMON
  • Memory IC Type:DDR2 DRAM
  • Refresh Cycles:8192
  • Sequential Burst Length:4,8
  • Interleaved Burst Length:4,8
  • Access Mode:FOUR BANK PAGE BURST
  • Self Refresh:YES
  • Length:12.5 mm
  • Width:10 mm

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