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Спецификация Часто задаваемые вопросы
  • Surface Mount:YES
  • Number of Terminals:153
  • HTS:8542.32.00.71
  • Automotive:No
  • PPAP:No
  • Chip Density (bit):1T
  • Timing Type:Synchronous
  • Interface Type:Serial e-MMC
  • Minimum Operating Supply Voltage (V):1.7|2.7
  • Typical Operating Supply Voltage (V):1.8|3.3
  • Maximum Operating Supply Voltage (V):1.95|3.6
  • Package Height:1
  • Package Width:11.5
  • Package Length:13
  • Package Description:FBGA-153
  • Package Style:GRID ARRAY, THIN PROFILE, FINE PITCH
  • Number of Words Code:128000000000
  • Package Body Material:PLASTIC/EPOXY
  • Operating Temperature-Min:-25 °C
  • Operating Temperature-Max:85 °C
  • Manufacturer Part Number:KLMDG8JENB-B0410
  • Clock Frequency-Max (fCLK):200 MHz
  • Number of Words:137438953472 words
  • Supply Voltage-Nom (Vsup):1.8 V
  • Package Code:TFBGA
  • Package Shape:RECTANGULAR
  • Manufacturer:Samsung Semiconductor
  • Part Life Cycle Code:Active
  • Ihs Manufacturer:SAMSUNG SEMICONDUCTOR INC
  • Risk Rank:5.78
  • Part Status:Unconfirmed
  • Type:MLC NAND TYPE
  • Technology:CMOS
  • Terminal Position:BOTTOM
  • Terminal Form:BALL
  • Number of Functions:1
  • Terminal Pitch:0.5 mm
  • Reach Compliance Code:compliant
  • JESD-30 Code:R-PBGA-B153
  • Supply Voltage-Max (Vsup):1.95 V
  • Temperature Grade:OTHER
  • Supply Voltage-Min (Vsup):1.7 V
  • Operating Mode:SYNCHRONOUS
  • Organization:128GX8
  • Seated Height-Max:1.2 mm
  • Memory Width:8
  • Memory Density:1099511627776 bit
  • Parallel/Serial:PARALLEL
  • Memory IC Type:FLASH
  • Programming Voltage:1.8 V
  • Width:11.5 mm
  • Length:13 mm

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