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110-43-328-41-001000
- Mill-Max Manufacturing Corp.
- Гнезда для ИС, транзисторов
- DIP
- CONN IC DIP SOCKET 28POS GOLD
- Date Sheet
Lagernummer 376
- 1+: $1.86327
- 10+: $1.75780
- 100+: $1.65830
- 500+: $1.56444
- 1000+: $1.47588
Zwischensummenbetrag $1.86327
Спецификация Часто задаваемые вопросы
- Factory Lead Time:3 Weeks
- Mount:Through Hole
- Mounting Type:Through Hole
- Package / Case:DIP
- Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid):28 (2 x 14)
- Contact Material - Mating:Beryllium Copper
- Contact Material - Post:Brass Alloy
- Contact Finish Mating:Gold
- Contact Materials:Copper
- Insulation Materials:Polychlorinated
- Operating Temperature:-55°C~125°C
- Packaging:Tube
- Series:110
- Published:2009
- JESD-609 Code:e3
- Pbfree Code:yes
- Part Status:Active
- Moisture Sensitivity Level (MSL):1 (Unlimited)
- Termination:Solder
- ECCN Code:EAR99
- Connector Type:DIP, Socket
- Type:DIP, 0.3 (7.62mm) Row Spacing
- Number of Positions:28
- Number of Rows:2
- HTS Code:8536.90.40.00
- Voltage - Rated DC:150V
- Orientation:Straight
- Terminal Pitch:2.54mm
- Depth:10.16mm
- Current Rating:3A
- Pitch - Mating:0.100 2.54mm
- Voltage - Rated AC:100V
- Number of Contacts:28
- Contact Finish - Post:Tin
- Contact Resistance:10mOhm
- Insulation Resistance:10GOhm
- Row Spacing:7.62 mm
- Termination Post Length:0.125 3.18mm
- Pitch - Post:0.100 2.54mm
- Features:Open Frame
- Length:35.5mm
- Width:10.16mm
- Contact Finish Thickness - Mating:30.0μin 0.76μm
- Contact Finish Thickness - Post:200.0μin 5.08μm
- REACH SVHC:No SVHC
- Radiation Hardening:No
- RoHS Status:ROHS3 Compliant
- Flammability Rating:UL94 V-0
- Lead Free:Lead Free
Со склада 376
- 1+: $1.86327
- 10+: $1.75780
- 100+: $1.65830
- 500+: $1.56444
- 1000+: $1.47588
Итого $1.86327