Изображение служит лишь для справки
24-6554-11
-
Aries Electronics
-
Гнезда для ИС, транзисторов
- DIP
- CONN IC DIP SOCKET ZIF 24POS GLD
Date Sheet
Lagernummer 27
- 1+： $21.20704
- 10+： $20.00664
- 100+： $18.87419
- 500+： $17.80584
- 1000+： $16.79796
Zwischensummenbetrag $21.20704
Спецификация Часто задаваемые вопросы
- Factory Lead Time：4 Weeks
- Mount：Through Hole
- Mounting Type：Through Hole
- Package / Case：DIP
- Housing Material：Polyphenylene Sulfide (PPS), Glass Filled
- Number of Positions or Pins (Grid)：24 (2 x 12)
- Contact Material - Mating：Beryllium Copper
- Contact Material - Post：Beryllium Copper
- Contact Finish Mating：Gold
- Contact Materials：Copper
- Packaging：Bulk
- Series：55
- Published：2008
- JESD-609 Code：e4
- Pbfree Code：yes
- Part Status：Active
- Moisture Sensitivity Level (MSL)：1 (Unlimited)
- Termination：Solder
- ECCN Code：EAR99
- Type：DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing
- Number of Positions：24
- Max Operating Temperature：105°C
- Min Operating Temperature：-55°C
- Number of Rows：2
- Gender：Female
- Additional Feature：STANDARD: UL 94V-0
- Orientation：Straight
- Current Rating：1A
- Pitch - Mating：0.100 2.54mm
- Voltage - Rated AC：1kV
- Body Length or Diameter：1.79 inch
- Lead Pitch：2.54mm
- Number of Contacts：24
- PCB Contact Pattern：RECTANGULAR
- Body Breadth：0.9 inch
- Body Depth：0.47 inch
- Contact Style：BELLOWED TYPE
- Insulation Resistance：1000000000Ohm
- Row Spacing：15.24 mm
- Mating Contact Pitch：0.1 inch
- Dielectric Withstanding Voltage：1000VAC V
- Termination Post Length：0.110 2.78mm
- Pitch - Post：0.100 2.54mm
- Features：Closed Frame
- Height：11.9mm
- Material Flammability Rating：UL94 V-0
- REACH SVHC：No SVHC
- RoHS Status：ROHS3 Compliant
- Flammability Rating：UL94 V-0
- Lead Free：Lead Free
Со склада 27
- 1+： $21.20704
- 10+： $20.00664
- 100+： $18.87419
- 500+： $17.80584
- 1000+： $16.79796
Итого $21.20704
Центр поддержки
услуга покупки
пункты договора
Корпорация Whisyee
Контакты