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  • Factory Lead Time:26 Weeks
  • Mounting Type:Surface Mount
  • Package / Case:TO-252-3, DPak (2 Leads + Tab), SC-63
  • Surface Mount:YES
  • Transistor Element Material:SILICON
  • Current - Continuous Drain (Id) @ 25℃:13A Tc
  • Drive Voltage (Max Rds On, Min Rds On):10V
  • Number of Elements:1
  • Power Dissipation (Max):110W Tc
  • Operating Temperature:-55°C~175°C TJ
  • Packaging:Tube
  • Series:HEXFET®
  • Published:2011
  • JESD-609 Code:e3
  • Part Status:Discontinued
  • Moisture Sensitivity Level (MSL):1 (Unlimited)
  • Number of Terminations:2
  • ECCN Code:EAR99
  • Terminal Finish:Matte Tin (Sn) - with Nickel (Ni) barrier
  • Additional Feature:AVALANCHE RATED, HIGH RELIABILITY
  • Terminal Position:SINGLE
  • Terminal Form:GULL WING
  • Peak Reflow Temperature (Cel):260
  • Time@Peak Reflow Temperature-Max (s):30
  • JESD-30 Code:R-PSSO-G2
  • Qualification Status:Not Qualified
  • Configuration:SINGLE WITH BUILT-IN DIODE
  • Operating Mode:ENHANCEMENT MODE
  • Case Connection:DRAIN
  • FET Type:P-Channel
  • Transistor Application:SWITCHING
  • Rds On (Max) @ Id, Vgs:295m Ω @ 6.6A, 10V
  • Vgs(th) (Max) @ Id:4V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds:860pF @ 25V
  • Gate Charge (Qg) (Max) @ Vgs:66nC @ 10V
  • Drain to Source Voltage (Vdss):150V
  • Vgs (Max):±20V
  • JEDEC-95 Code:TO-252AA
  • Drain Current-Max (Abs) (ID):13A
  • Drain-source On Resistance-Max:0.295Ohm
  • Pulsed Drain Current-Max (IDM):44A
  • DS Breakdown Voltage-Min:150V
  • Avalanche Energy Rating (Eas):310 mJ
  • RoHS Status:ROHS3 Compliant

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