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Lagernummer 0

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  • Lifecycle Status:ACTIVE (Last Updated: 5 days ago)
  • Factory Lead Time:6 Weeks
  • Contact Plating:Copper, Tin
  • Mount:Surface Mount
  • Mounting Type:Surface Mount
  • Package / Case:8-PowerVDFN
  • Number of Pins:8
  • Transistor Element Material:SILICON
  • Current - Continuous Drain (Id) @ 25℃:50A Ta
  • Drive Voltage (Max Rds On, Min Rds On):6V 10V
  • Number of Elements:1
  • Power Dissipation (Max):2.8W Ta 83W Tc
  • Turn Off Delay Time:10 ns
  • Operating Temperature:-55°C~150°C TJ
  • Packaging:Tape & Reel (TR)
  • Series:NexFET™
  • JESD-609 Code:e3
  • Pbfree Code:yes
  • Part Status:Active
  • Moisture Sensitivity Level (MSL):1 (Unlimited)
  • Number of Terminations:5
  • ECCN Code:EAR99
  • Terminal Finish:Matte Tin (Sn)
  • Additional Feature:AVALANCHE RATED
  • Terminal Position:DUAL
  • Terminal Form:NO LEAD
  • Reach Compliance Code:not_compliant
  • Base Part Number:CSD19537
  • Configuration:SINGLE WITH BUILT-IN DIODE
  • Number of Channels:1
  • Operating Mode:ENHANCEMENT MODE
  • Power Dissipation:2.8W
  • Case Connection:DRAIN
  • Turn On Delay Time:5 ns
  • FET Type:N-Channel
  • Transistor Application:SWITCHING
  • Rds On (Max) @ Id, Vgs:14.5m Ω @ 10A, 10V
  • Vgs(th) (Max) @ Id:3.6V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds:1680pF @ 50V
  • Gate Charge (Qg) (Max) @ Vgs:21nC @ 10V
  • Rise Time:3ns
  • Vgs (Max):±20V
  • Fall Time (Typ):3 ns
  • Continuous Drain Current (ID):9.7A
  • Threshold Voltage:3V
  • Gate to Source Voltage (Vgs):20V
  • Drain to Source Breakdown Voltage:100V
  • Avalanche Energy Rating (Eas):55 mJ
  • Max Junction Temperature (Tj):150°C
  • Height:1.1mm
  • Length:3.3mm
  • Width:3.3mm
  • Thickness:1mm
  • RoHS Status:ROHS3 Compliant
  • Lead Free:Contains Lead

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