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Lagernummer 0

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Спецификация Часто задаваемые вопросы
  • Factory Lead Time:12 Weeks
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154, 3.90mm Width)
  • Surface Mount:YES
  • Transistor Element Material:SILICON
  • Current - Continuous Drain (Id) @ 25℃:10A Ta
  • Drive Voltage (Max Rds On, Min Rds On):2.8V 10V
  • Number of Elements:1
  • Power Dissipation (Max):2.5W Ta
  • Operating Temperature:-55°C~150°C TJ
  • Packaging:Tape & Reel (TR)
  • Series:HEXFET®
  • Published:2003
  • JESD-609 Code:e3
  • Part Status:Active
  • Moisture Sensitivity Level (MSL):1 (Unlimited)
  • Number of Terminations:8
  • ECCN Code:EAR99
  • Terminal Finish:Matte Tin (Sn)
  • Terminal Position:DUAL
  • Terminal Form:GULL WING
  • Peak Reflow Temperature (Cel):260
  • Time@Peak Reflow Temperature-Max (s):30
  • JESD-30 Code:R-PDSO-G8
  • Configuration:SINGLE WITH BUILT-IN DIODE
  • Operating Mode:ENHANCEMENT MODE
  • FET Type:N-Channel
  • Transistor Application:SWITCHING
  • Rds On (Max) @ Id, Vgs:13m Ω @ 10A, 10V
  • Vgs(th) (Max) @ Id:2V @ 250μA
  • Input Capacitance (Ciss) (Max) @ Vds:3430pF @ 20V
  • Gate Charge (Qg) (Max) @ Vgs:44nC @ 4.5V
  • Drain to Source Voltage (Vdss):40V
  • Vgs (Max):±12V
  • JEDEC-95 Code:MS-012AA
  • Drain Current-Max (Abs) (ID):10A
  • Drain-source On Resistance-Max:0.013Ohm
  • Pulsed Drain Current-Max (IDM):85A
  • DS Breakdown Voltage-Min:40V
  • Avalanche Energy Rating (Eas):300 mJ
  • RoHS Status:ROHS3 Compliant

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